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IEEE International Conference on Microelectronic Test Structures

ICMTS 2011 Program

2011 Program Booklet


By First Author

Microsecond pulsed DC matching measurements on MOSFETs in strong and weak inversion
P. Andricciola, H. Tuinhout, N. Wils, J. Schmitz
Central Research and Development, NXP Semiconductors, Eindhoven, Netherlands
DOI: 10.1109/ICMTS.2011.5976866
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A simple system for on-die measurement of atto-Farad capacitance
E. Baruch, S. Shperber, R. Levy, Y. Weizman, J. Fridburg, R. Marks
Freescale Semiconductor Israel Limited, Herzliya, Israel
DOI: 10.1109/ICMTS.2011.5976854
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Sensing mobility mismatch due to local interconnect mechanical stress in CMOS technology
S. Blayac, C. Rivero1, P. Fornara1, L. Lopez1, N. Demange1
CMP/PS2, Ecole des Mines de Saint Etienne, Gardanne, France
1STMicroelectronics, Rousset, France
DOI: 10.1109/ICMTS.2011.5976847
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High temperature on-wafer measurement structure for DMOS characterization
C. Boianceanu, D. Simon, R. Blanaru, D. Costachescu, M. Pfost1
Infineon Technologies Romania, IFRO ATV TM, Bucharest, Romania
1Robert-Bosch-Center of Power Electronics, Reutlingen University, Reutlingen, Germany
DOI: 10.1109/ICMTS.2011.5976841
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Decoupling of RTS noise in high density CMOS image sensor using new test structures
J. -D. Bok, I. -S. Han, H. -M. Kwon, S. -U. Park, Y. -J. Jung, S. -H. Park, W. -I. Choi, M. -L. Ha, J. -I. Lee, H. -D. Lee
Department of Electronics Engineering, Chungnam National University, Daejeon, South Korea
DOI: 10.1109/ICMTS.2011.5976865
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Simple current and capacitance methods for bulk finFET height extraction and correlation to device variability
T. Chiarella, B. Parvais, N. Horiguchi, M. Togo, C. Kerner, L. Witters, P. Absil, S. Biesemans, T. Hoffmann
IMEC vzw, Leuven, Belgium
DOI: 10.1109/ICMTS.2011.5976879
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Interdigitated electrode modelling for applications in dielectrophoresis
C. Chung, S. Smith, A. Menachery, P. Bagnaninchi, A. J. Walton, R. Pethig
Institute for Integrated Micro and Nano Systems, School of Engineering, Scottish Microelectronics Centre, University of Edinburgh, UK
DOI: 10.1109/ICMTS.2011.5976863
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Strategy for in-line MOS transistor transport optimization
A. Cros
Crolles Site, TResearch and Development/STD/TPS/ECR, STMicroelectronics, Crolles, France
DOI: 10.1109/ICMTS.2011.5976860
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Experimental procedure for accurate trap density study by low frequency charge pumping measurements
A. Datta, F. Driussi, D. Esseni, G. Molas1, E. Nowak1
DIEGM, IU.NET, University of Udine, Udine, Italy
1Leti, CEA, Grenoble, France
DOI: 10.1109/ICMTS.2011.5976876
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Gap-closing test structures for temperature budget determination
E. J. Faber, R. A. M. Wolters1, J. Schmitz
MESA Institute for Nanotechnology, Semiconductor Components Group, University of Twente, Enschede, Netherlands
1NXP Semiconductors, Eindhoven, Netherlands
DOI: 10.1109/ICMTS.2011.5976840
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Test structures and a measurement system for characterising the lifetime of EWOD devices
D. Gruber, Y. Li1, S. Smith1, A. Tiwari1, F. Deng1, A. A. Stokes2, J. G. Terry1, A. S. Bunting1, L. Mackay1, P. Langridge-Smith2, A. J. Walton1
SIRCAMS School of Chemistry, University of Edinburgh, Edinburgh, UK
1Scottish Microelectronic Centre, Institute of Micro and Nano Systems Institute of Integrated Systems School of Engineering, University of Edinburgh, Edinburgh, UK
2The University of Edinburgh, Edinburgh, Edinburgh, GB
DOI: 10.1109/ICMTS.2011.5976864
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Exploring capacitance-voltage measurements to find the piezoelectric coefficient of aluminum nitride
T. van Hemert, D. Sarakiotis, S. Jose, R. J. E. Hueting, J. Schmitz
MESA Institute for Nanotechnology, University of Twente, Enschede, Netherlands
DOI: 10.1109/ICMTS.2011.5976862
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Product relevant device leakage scribe characterization vehicle test chip for efficient full wafer testing
C. Hess, R. Firu, R. Vallishayee, S. Yu, P. Zhao, S. Zhao
PDF Solutions, Inc.orporated, San Jose, CA, USA
DOI: 10.1109/ICMTS.2011.5976857
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Novel BJT test structure for high-performance matching characteristics in CMOS-based analog applications
Y. -J. Jung, B. -S. Park, I. -S. Han, H. -M. Kwon, S. -U. Park, J. -D. Bok, Y. -S. Chung, M. -G. Lim, J. -H. Lee, H. -D. Lee
Department of Electronics Engineering, Chungnam National University, Daejeon, South Korea
DOI: 10.1109/ICMTS.2011.5976846
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Design of a test chip with small embedded temperature sensor structures realized in a common-drain power trench technology
H. Köck, R. Illing1, T. Ostermann1, S. Decker2, D. Dibra2, G. Pobegen3, S. de Filippis4, M. Glavanovics3, D. Pogany
Institute of Solid State Electronics, University of Technology, Vienna, Vienna, Austria
1DC ATV BP, Infineon Technologies Austria AG, Villach, Austria
2ATV PTP TD, Infineon Technologies, Neubiberg, Germany
3KAI (Kompetenzzentrum Automobil-und Industrie-Elektronik), Villach, Austria
4Department of Electronic and Telecommunication Engineering, University of Napoli Federico II, Naples, Italy
DOI: 10.1109/ICMTS.2011.5976842
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Scalable thermal resistance model for single and multi-finger silicon-on-insulator MOSFETs
S. Khandelwal, J. Watts1, E. Tamilmani2, L. Wagner3
Department of Electronics and Telecommunication, Norwegian University of Science and Technology, Norway
1IBM Semiconductor Research and Development Centre, Burlington, USA
2IBM Semiconductor Research and Development Centre, Bangalore, India
3IBM Semiconductor Research and Development Centre, East Fishkill, USA
DOI: 10.1109/ICMTS.2011.5976843
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A versatile defectivity monitor designed for efficient test and failure analysis
M. Lauderdale, B. Smith
Freescale Semiconductor, Inc., Austin, TX, USA
DOI: 10.1109/ICMTS.2011.5976855
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Lateral bipolar structures for evaluating the effectiveness of surface doping techniques
G. Lorito, L. Qi, L. K. Nanver
DIMES, Delft University of Technnology, Delft, Netherlands
DOI: 10.1109/ICMTS.2011.5976870
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Innovative thin film deposition technologies enabling new materials and new device integration roadmaps
J. W. Maes
ASM, The Netherlands
DOI: 10.1109/ICMTS.2011.5976869
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Variation-sensitive monitor circuits for estimation of Die-to-Die process variation
I. A. K. M. Mahfuzul, A. Tsuchiya, K. Kobayashi1, H. Onodera2
Graduate School of Informatics, Kyoto University, Kyoto, Japan
1Graduate School of Science and Technology, Kyoto Institute of Technology, Kyoto, Japan
2CREST, Japan Science and Technology Agency, Japan
DOI: 10.1109/ICMTS.2011.5976878
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Admittance characterization and interface trap property extraction for Ge/III-V MOS structures
K. Martens
IMEC, Belgium
DOI: 10.1109/ICMTS.2011.5976850
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Improved parameter extraction procedures for the R3 model
C. C. McAndrew, T. Bettinger
Freescale Semiconductor, Inc., Tempe, AZ, USA
DOI: 10.1109/ICMTS.2011.5976858
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Characterisation of electroplated NiFe films using test structures and wafer mapped measurements
J. Murray, G. Schiavone1, S. Smith1, J. Terry1, A. R. Mount2, A. J. Walton1
School of Chemistry, University of Edinburgh, UK
1Institute for Integrated Micro and Nano Systems (part of the Joint Research Institute for Integrated Systems), School of Engineering, Scottish Microelectronics Centre, University of Edinburgh, Edinburgh, UK
2The University of Edinburgh, Edinburgh, Edinburgh, GB
DOI: 10.1109/ICMTS.2011.5976861
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Matching characteristics of metal resistors
H. Namba, T. Hashimoto, K. Hayashi, M. Furumiya
Device Framework Development Department, Renesas Electronics Corporation, 1753, Shimonumabe, Nakahara-Ku, Kawasaki, Kanagawa 211-8668, Japan
DOI: 10.1109/ICMTS.2011.5976844
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An efficient array structure to characterize the impact of through silicon vias on FET devices
D. Perry, J. Cho1, S. Domae2, P. Asimakopoulos3, A. Yakovlev3, P. Marchal4, G. Van der Plas4, N. Minas4
Qualcomm, San Diego, CA, USA
1Samsung, IMEC, Belgium
2Panasonic, IMEC, Belgium
3University of Newcastle, UK
4IMEC, Leuven, Belgium
DOI: 10.1109/ICMTS.2011.5976872
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Front-end-of-line quadrature-clocked voltage-dependent capacitance measurement
S. Polonsky, P. Solomon, J. -h. Liao1, L. Medina1, M. Ketchen
IBM Thomson J.Watson Research Center, Yorktown Heights, NY, USA
1IBM Systems and Technology Group, Hopewell Junction, NY, USA
DOI: 10.1109/ICMTS.2011.5976851
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Low cost wafer level parallel test strategy for reliability assessments in sub-32nm technology nodes
M. Rafik, F. Dieudonné, G. Morin
Crolles Site, TResearch and Development, STD, TPS, ECR, STMicroelectronics, Crolles, France
DOI: 10.1109/ICMTS.2011.5976856
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Device variability and correlation control by automated tuning of SPICE cards to PCM measurements
A. Revelant, L. Lucci, L. Selmi1, B. Ankele
Infineon Technologies Austria AG, Villach, Austria
1DIEGM, Università degli Studi di Udine, Udine, Italy
DOI: 10.1109/ICMTS.2011.5976877
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Contact resistance measurement structures for high frequencies
D. Roy, R. M. T. Pijper, L. F. Tiemeijer, R. A. M. Wolters
Central Research and Development, NXP Semiconductors, Eindhoven, Netherlands
DOI: 10.1109/ICMTS.2011.5976859
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Gated diode in breakdown voltage collapse regime -- A test vehicle for oxide characterization
A. Rusu, M. Badila1, A. Rusu
University POLITEHNICA of Bucharest, Romania
1On Semiconductor, Santa Clara, CA, USA
DOI: 10.1109/ICMTS.2011.5976875
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Nonlinear network analyzer measurements for better transistor modeling
F. Sischka
Agilent Technologies, Inc., Boblingen, Germany
DOI: 10.1109/ICMTS.2011.5976867
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Silicon high frequency test structures improvement for millimeter wave varactors characterization optimization and modeling
F. Sonnerat, R. Debroucke1, Y. Morandini2, D. Gloria, J. -D. Arnould3, C. Gaquière4
TRD, TPS Laboratory, STMicroelectronics, Crolles, France
1I.E.M.N, Villeneuve d'Ascq, France
2SRDC, IBM, Crolles, France
3IMEP, Grenoble, France
4NA
DOI: 10.1109/ICMTS.2011.5976868
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New test structure for evaluating low-k dielectric interconnect layers by using ring-oscillators and metal comb/serpentine patterns
Y. Tamaki, M. Ito, Y. Takimoto1, M. Hashino, Y. Kawamoto
Consortium for Advanced Semiconductor Materials and Related Technologies (CASMAT), Kokubunji-shi, Tokyo, JAPAN
1JSR Corporation, Japan
DOI: 10.1109/ICMTS.2011.5976873
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Electrical estimation of channel dopant uniformity using test MOSFET array
K. Terada, K. Sanai, K. Tsuji, T. Tsunomura1, A. Nishida1, T. Mogami1
Faculty of Information Sciences, Hiroshima City University, Hiroshima, Japan
1MIRAI-Selete, Tsukuba, Ibaraki, Japan
DOI: 10.1109/ICMTS.2011.5976871
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Evaluation of MOSFET C-V curve variation using test structure for charge-based capacitance measurement
K. Tsuji, K. Terada, R. Kikuchi, T. Tsunomura1, A. Nishida1, T. Mogami1
Faculty of Information Sciences, Hiroshima City University, Hiroshima, Japan
1MIRAI-Selete, Tsukuba, Ibaraki, Japan
DOI: 10.1109/ICMTS.2011.5976852
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Radiation effects upon the mismatch of identically laid out transistor pairs
J. Verbeeck, P. Leroux, M. Steyaert1
Department IBW-RELIC, Katholieke hogeschool Kempen, Geel, Belgium
1Department ESAT-MICAS, Katholieke Universiteit Leuven, Heverlee, Belgium
DOI: 10.1109/ICMTS.2011.5976845
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Characterization and modelling of gate current injection in embedded non-volatile flash memory
A. Zaka, D. Garetto1, D. Rideau, P. Palestri2, J. -P. Manceau1, E. Dornel1, Q. Rafhay3, R. Clerc3, Y. Leblebici4, C. Tavernier, H. Jaouen
STMicroelectronics, Crolles, France
1IBM S and TG, Crolles, France
2DIEGM, University of Udine, Udine, Italy
3MINATEC, LAHC, IMEP, Grenoble, France
4Ecole Polytechnique Fédérale de Lausanne, Lausanne, Switzerland
DOI: 10.1109/ICMTS.2011.5976874
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Modeling the frequency dependence of MOSFET gate capacitance
Z. Zhu, G. Gildenblat, C. C. McAndrew1, I. -S. Lim1
School of Electrical, Computer and Energy Engineering, Arizona State University, Tempe, AZ, USA
1Freescale Semiconductor, Inc., Tempe, AZ, USA
DOI: 10.1109/ICMTS.2011.5976853
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