Photo by Wan San Yip on Unsplash

IEEE International Conference on Microelectronic Test Structures

ICMTS 2002 Program

2002 Program Booklet


By First Author

Test structures for referencing electrical linewidth measurements to silicon lattice parameters using HRTEM
R. A. Allen, M. W. Cresswell, C. E. Murabito, W. F. Guthrie, L. W. Linholm, C. H. Ellenwood, E. Hal Bogardus1
Semiconductor Electronics Division, National Institute of Standards and Technology, Gaithersburg, Maryland, USA
1Intemational SEMATECH, Austin, Texas, USA
DOI: 10.1109/ICMTS.2002.1193163
HOVER FOR ABSTRACT
PDF
Xplore
Verification structures for transmission line pulse measurements
R. A. Ashton
Agere Systems, Orlando, FL, USA
DOI: 10.1109/ICMTS.2002.1193191
HOVER FOR ABSTRACT
PDF
Xplore
Test structures for analyzing radiation effects in bipolar technologies
H. J. Barnaby, R. D. Schrimpf1, K. F. Galloway1, D. R. Ball1, R. L. Pease2, P. Fouillat3
Electrical & Computer Engineering Department, University of Arizona Tucson, Tucson, AZ, USA
1Electrical Engineering & Computer Science Department, Vanderbilt University, Nashville, TN, USA
2RLP Research, Inc., Albuquerque, NM, USA
3University of Bordeaux 1, Bordeaux, France
DOI: 10.1109/ICMTS.2002.1193196
HOVER FOR ABSTRACT
PDF
Xplore
Triple-junction colour sensor fully compatible with CMOS technology: results of a test chip
G. . -F. Dalla Betta, N. Zorzi, P. Bellutti, M. Boscardin, G. Soncini
Divisione Microsistemi, ITC IRST, Trento, Italy
DOI: 10.1109/ICMTS.2002.1193199
HOVER FOR ABSTRACT
PDF
Xplore
Characterisation of microfluidic devices
D. C. S. Bien, S. J. N. Mitchell, H. S. Gamble
School of Electrical and Electronic Engineering, Queen's University, Belfast, UK
DOI: 10.1109/ICMTS.2002.1193198
HOVER FOR ABSTRACT
PDF
Xplore
High frequency test structures definition for electromagnetic coupling study between two symmetrical inductors. Electrical modelling of the whole coupling between coils
C. Clement, B. Van Haaren, D. Gloria
Central Research & Development, STMicroelectronics, Crolles, France
DOI: 10.1109/ICMTS.2002.1193166
HOVER FOR ABSTRACT
PDF
Xplore
A comparison of extraction techniques for threshold voltage mismatch
J. A. Croon, H. P. Tuinhout1, R. Difrenza2, J. Knol3, A. J. Moonen3, S. Decoutere, H. E. Maes, W. Sansen4
IMEC vzw, Leuven, Belgium
1Philips Research, The Netherlands
2LPCS, ENSERG, Grenoble, France
3Philips Semiconductors, Nijmegen, The Netherlands
4K.U. Leuven, ESAT, Leuven, Belgium
DOI: 10.1109/ICMTS.2002.1193202
HOVER FOR ABSTRACT
PDF
Xplore
Comparison between matching parameters and fluctuations at the wafer level
R. Difrenza, P. Llinares1, S. Taupin1, R. Palla1, C. Garnier1, G. Ghibaudo
LPCS, ENSERG, Grenoble, France
1Central R&D, STMicroelectronics, Crolles, France
DOI: 10.1109/ICMTS.2002.1193203
HOVER FOR ABSTRACT
PDF
Xplore
An assessment of physical and electrical design rule based statistical process monitoring and modeling (PEDR-SPMM): for foundry manufacturing line of multiple-product mixed-run
K. Y. . -Y. Doong, S. Hsieh1, S. C. Lin1, L. J. Hung1, R. J. Wang1, Binson Shen1, J. W. Hisa1, J. C. Guo1, I. C. Chen1, K. L. Young1, C. C. . -H. Hsu
Microelectronics Laboratory, Semiconductor Technology & Application Research (STAR) Group, Department of Electrical Engineering, National Tsing Hua University, Taiwan
1Taiwan Semiconductor Manufacturing Corporation, Hsinchu, Taiwan
DOI: 10.1109/ICMTS.2002.1193171
HOVER FOR ABSTRACT
PDF
Xplore
A consistent and scalable PSPICE HFET-Model for DC- and S-parameter-simulation
S. Ehrich, R. M. Bertenburg1, M. Agethen1, A. Brennemann1, W. Brockerhoff, F. . -J. Tegude
Solid-State Electronics Department, Gerhard-Mercator-University Duisburg, Duisburg, Germany
1IPAG, Duisburg, Germany
DOI: 10.1109/ICMTS.2002.1193173
HOVER FOR ABSTRACT
PDF
Xplore
Direct measurement of field transistor threshold voltages using inversion layer fed transistors in deep submicron processes
J. N. Ellis
Zarlink Semiconductor Limited, Plymouth, Devon, UK
DOI: 10.1109/ICMTS.2002.1193192
HOVER FOR ABSTRACT
PDF
Xplore
Measurement of the linewidth of electrical test-structure reference features by automated phase-contrast image analysis
B. A. am Ende, M. W. Cresswell, R. A. Allen, T. J. Headley1, W. F. Guthrie2, L. W. Linholm, E. H. Bogardus3, C. E. Murabito2
Semiconductor Electronics Division, National Institute of Standards and Technology, USA
1Sandia National Laboratories, USA
2Semiconductor Electronics Division, National Institute of Standards and Technology
3International SEMATECH, USA
DOI: 10.1109/ICMTS.2002.1193161
HOVER FOR ABSTRACT
PDF
Xplore
A new test structure and characterization methodology to identify array leakage path in Mask ROM
T. Fan, K. Y. Chan, T. C. Lu, S. Pan
Special Device / Modeling Dept., Macronix International Co. Ltd., Hsinchu, Taiwan, R.O.C.
DOI: 10.1109/ICMTS.2002.1193169
HOVER FOR ABSTRACT
PDF
Xplore
New spider-webs test structure and characterization methodology for flash memory tunnel oxide quality
T. H. Fan, T. C. Lu, S. Pan
Special Device /Modeling Dept, Macronix International Company Limited, Hsinchu, Taiwan
DOI: 10.1109/ICMTS.2002.1193185
HOVER FOR ABSTRACT
PDF
Xplore
Extraction method for substrate resistance of RF MOSFETs
Jeonghu Han, Minkyu Je, Hyungcheol Shin
Department of EECS, KAIST, Taejon, South Korea
DOI: 10.1109/ICMTS.2002.1193167
HOVER FOR ABSTRACT
PDF
Xplore
Systematic mismatch in diffusion resistors caused by photolithography
S. Hausser, S. Majoni, H. Schligtenhorst, G. Kolwe
Philips Semiconductors GmbH, Boeblingen, Germany
DOI: 10.1109/ICMTS.2002.1193204
HOVER FOR ABSTRACT
PDF
Xplore
Impact of probe configuration and calibration techniques on quality factor determination of on-wafer inductors for GHz applications
R. J. Havens, L. F. Tiemeijer, L. Garnbus1
Philips Research Laboratories, Eindhoven, The Netherlands
1NA
DOI: 10.1109/ICMTS.2002.1193164
HOVER FOR ABSTRACT
PDF
Xplore
Logic characterization vehicle to determine process variation impact on yield and performance of digital circuits
C. Hess, B. E. Stine, L. H. Weiland, K. Sawada1
PDF Solutions, Inc.orporated, San Jose, CA, USA
1Toshiba Corporation, Kawasaki, Japan
DOI: 10.1109/ICMTS.2002.1193195
HOVER FOR ABSTRACT
PDF
Xplore
Passive multiplexer test structure for fast and accurate contact and via fail rate evaluation
C. Hess, B. E. Stine, L. H. Weiland, T. Mitchell1, M. Karnett2, K. Gardner1
Philips Semiconductor, San Antonio, TX, USA
1Philips Semiconductors, San Antonio, TX, USA
2PDF Solutions Inc., San Jose, CA, USA
DOI: 10.1109/ICMTS.2002.1193190
HOVER FOR ABSTRACT
PDF
Xplore
Test structures for a MEMS SiOx/metal process
M. Hill, C. O'Mahony, P. J. Hughes, B. Lane, A. Mathewson
National Microelectronics Research Centre, Cork, Ireland
DOI: 10.1109/ICMTS.2002.1193197
HOVER FOR ABSTRACT
PDF
Xplore
Extraction of the base and emitter resistances in bipolar transistors using an accurate base resistance model
F. Ingvarson, M. Linder1, K. O. Jeppson
Solid State Electronics Laboratory, Department of Microelectronics ED, Chalmers University of Technology, Gothenburg, Sweden
1Department of Electronics, Malardalens Hogskola, Vasteras, Sweden
DOI: 10.1109/ICMTS.2002.1193174
HOVER FOR ABSTRACT
PDF
Xplore
A novel method to characterize the dielectric and interfacial properties of Ba/sub 0.5/Sr/sub 0.5/TiO3 (BST)/Si by microwave measurement
Hang-Ting Lue, Tseung-Yuen Tseng, Guo-Wei Huang1
Department of Electronics Engineering and Institute of Electronics, National Chiao Tung University, Hsinchu, Taiwan
1National Nano Device Laboratories, Hsinchu, Taiwan
DOI: 10.1109/ICMTS.2002.1193179
HOVER FOR ABSTRACT
PDF
Xplore
Influence of probing configuration and data set size for bipolar junction capacitance determination
D. Macsweeney, K. G. McCarthy1, L. Floyd2, A. Mathewson2, P. Hurley2, J. A. Power3, S. C. Kelly3
Cypress Semiconductor Corporation, Cork, Ireland
1National Microelectronics Research Centre, University College Cork, Ireland
2Department of Electrical and Electronic Engineering, University College Cork, Ireland
3Analog Devices, Inc., Limerick, Ireland
DOI: 10.1109/ICMTS.2002.1193184
HOVER FOR ABSTRACT
PDF
Xplore
Useful numerical techniques for compact modeling
C. C. McAndrew
Motorola, Inc., Tempe, AZ, USA
DOI: 10.1109/ICMTS.2002.1193183
HOVER FOR ABSTRACT
PDF
Xplore
Extraction of the coupling coefficients for the top-floating-gate (TFG) flash EEPROM cell
D. McCarthy, M. O'Shea, R. Duane, K. Mccarthy1, A. Concannon2, A. Mathewson
National Microelectronics Research Centre, Cork, Ireland
1Department of Electrical & Electronic Engineering, University College Cork, Ireland
2National Semiconductor Corporation, Santa Clara, CA, USA
DOI: 10.1109/ICMTS.2002.1193186
HOVER FOR ABSTRACT
PDF
Xplore
A combined RG/CF large-signal extraction methodology to improve CMOS SPICE-parameter precision
S. Mecking, A. Korbel, E. Paparisto1, U. Langmann
Ruhr-Universität Bochum, Elektronische Bauelemente, Bochum, Germany
1Infineon Technologies AG Germany, Bochum, Germany
DOI: 10.1109/ICMTS.2002.1193181
HOVER FOR ABSTRACT
PDF
Xplore
Sensitive measurement method for evaluation of high thermal resistance in bipolar transistors
N. Nenadovic, L. K. Nanver, H. Schellevis, D. de Mooij1, V. Zieren1, J. W. Slotboom
Laboratory of ECTM, DIMES, Delft University of Technnology, Delft, Netherlands
1Philips Research Laboratories, Eindhoven, Netherlands
DOI: 10.1109/ICMTS.2002.1193175
HOVER FOR ABSTRACT
PDF
Xplore
Compact model development for a new non-volatile memory cell architecture
M. O'Shea, D. McCarthy, R. Duane, K. McCarthy1, A. Concannon2, A. Mathewson
National Microelectronics Research Centre, Cork, Ireland
1Department of Electrical & Electronic Engineering, University College Cork, Ireland
2National Semiconductor Corporation, Santa Clara, CA, USA
DOI: 10.1109/ICMTS.2002.1193188
HOVER FOR ABSTRACT
PDF
Xplore
A test structure for spectrum analysis of hot-carrier-induced photoemission from subquarter-micron CMOSFETs
S. Odanaka, K. Yamashita, N. Koike1, K. Tatsuuma2
Department of Electronics and Informatics, Toyama Prefectural University, Toyama, Japan
1Cybermedia Center, Osaka University, Osaka, Japan
2ULSI Process Technology Development Center, Matsushita Electric Ind. Co., Ltd., Kyoto, Japan
DOI: 10.1109/ICMTS.2002.1193178
HOVER FOR ABSTRACT
PDF
Xplore
CV doping profiling of boron out-diffusion using an abrupt and highly doped arsenic buried epilayer
C. J. Ortiz, L. K. Nanver, W. D. van Noort, T. L. M. Scholtes, J. W. Slotboom
Laboratory of ECTM, DIMES, Delft University of Technnology, Delft, Netherlands
DOI: 10.1109/ICMTS.2002.1193176
HOVER FOR ABSTRACT
PDF
Xplore
Low current application dedicated process characterization method
W. Rahajandraibe, C. Dufaza, D. Auvergne, B. Cialdella1, B. Majoux1, V. Chowdhury1
LIRMM UMR C5506 CNRS, Université de Montpellier II, Montpellier, France
1STMicroelectronics, Grenoble, France
DOI: 10.1109/ICMTS.2002.1193168
HOVER FOR ABSTRACT
PDF
Xplore
Wafer-level characterization of EEPROM tunnel oxide using a fast floating-gate technique and a realistic memory cell-based test structure
S. Renard, P. Boivin, J. L. Autran1
STMicroelectronics, Zone Industrielle de Rousset, Rousset, France
1L2MP, UMR CNRS 6137, Université Ax-Marseille 1, Bâtiment IRPHE, Marseilles, France
DOI: 10.1109/ICMTS.2002.1193187
HOVER FOR ABSTRACT
PDF
Xplore
A test structure for the design of thermal flow sensors
N. Sabate, I. Gracia, J. Santander, C. Cane
CSIC, Centre National de Microelectronica, Bellaterra, Spain
DOI: 10.1109/ICMTS.2002.1193180
HOVER FOR ABSTRACT
PDF
Xplore
Test structure for precise statistical characteristics measurement of MOSFETs
Y. Shimizu, M. Nakamura, T. Matsuoka, K. Taniguchi
Department of Electronics and Information Systems, Osaka University, Suita, Osaka, Japan
DOI: 10.1109/ICMTS.2002.1193170
HOVER FOR ABSTRACT
PDF
Xplore
Metallization proximity studies for copper spiral inductors on silicon
C. B. Sia, K. S. Yeo1, Shao-Fu Chu, Z. Zeng, T. H. Lee
Chartered Semiconductor Manufacturing Private Limited, Singapore
1School of Electrical and Electronic Engineering, Nanyang Technological University, Singapore
DOI: 10.1109/ICMTS.2002.1193165
HOVER FOR ABSTRACT
PDF
Xplore
Methodology for defect impact studies under conditions of low electrical testing coverage
A. Skumanich, E. Ryabova
Applied Materials, Santa Clara, CA, USA
DOI: 10.1109/ICMTS.2002.1193193
HOVER FOR ABSTRACT
PDF
Xplore
Electrical CD characterisation of binary and alternating aperture phase shifting masks
S. Smith, M. McCallum1, A. J. Walton, J. T. M. Stevenson
Department of Electronics and Electrical Engineering, Scottish Mieroelectronics Centre, University of Edinburgh, Edinburgh, UK
1Xikon Court, Nikon Precision Europe, Livingston, UK
DOI: 10.1109/ICMTS.2002.1193162
HOVER FOR ABSTRACT
PDF
Xplore
Test structures for the electrical characterisation of platinum deposited by focused ion beam
S. Smith, A. J. Walton, S. Bond, A. W. S. Ross, J. T. M. Stevenson, A. M. Gundlach
Department of Electronics and Electrical Engineering, Scottish Microelectronics Centre, University of Edinburgh, Edinburgh, UK
DOI: 10.1109/ICMTS.2002.1193189
HOVER FOR ABSTRACT
PDF
Xplore
BSIM4.1 DC parameter extraction on 50 nm n-pMOSFETs
D. Souil, G. Guegan, G. Bertrand, O. Faynot, S. Deleonibs1, G. Ghibaudo2
CEA-LETI, Laboratoire d'Electronique et des Technologies de l'Information, Grenoble Cedex 9, France
1NA
2Institut de Microélectronique, d'Electromagnétisme et de Photonique (IMEP), Grenoble Cedex 1, France
DOI: 10.1109/ICMTS.2002.1193182
HOVER FOR ABSTRACT
PDF
Xplore
Strategies and test structures for improving isolation between circuit blocks
D. Szmyd, L. Gambus1, A. Wilbanks2
Philips Semiconductors, Hopewell Junction, NY, United States
1Philips Semiconductors, Caen, France
2Philips Semiconductors, Albuquerque, NM, United States
DOI: 10.1109/ICMTS.2002.1193177
HOVER FOR ABSTRACT
PDF
Xplore
Novel charge pumping method without using MOS transistor for SOI wafer inspection
T. Takami, H. Yoshida, T. Uchihashi, S. Kishino
Department of Electronics, Himeji Institute of Technology, Himeji, Japan
DOI: 10.1109/ICMTS.2002.1193194
HOVER FOR ABSTRACT
PDF
Xplore
A test circuit for measuring standard deviations of MOSFET channel conductance and threshold voltage
K. Terada, M. Sumida
Faculty of Information Sciences, Hiroshima City University, Asaminami, Hiroshima, Japan
DOI: 10.1109/ICMTS.2002.1193172
HOVER FOR ABSTRACT
PDF
Xplore

Design and characterisation of a high precision resistor ladder test structure
H. P. Tuinhout, G. Hoogzaad1, M. Vertregt, R. L. J. Roovers, C. Erdmann2
Prof. Holstlaan 4 (WAY41), Philips Research, Eindhoven, Netherlands
1Philips Semiconductors, Delft, Netherlands
2Philips Semiconductors, Caen, France
DOI: 10.1109/ICMTS.2002.1193200
HOVER FOR ABSTRACT
PDF
Xplore
A robust and production worthy addressable array architecture for deep sub-micron MOSFET's matching characterization
S. B. Yeo, J. Bordelon1, S. Chu2, M. F. Li, B. A. Tranchina3, M. Harward1, L. H. Chan2, A. See2
The National University of Singapore, Singapore
1Telcordia Technologies, Inc., USA
2Chartered Semiconductor Mfg. Ltd, Singapore
3TestChip Technologies, Inc
DOI: 10.1109/ICMTS.2002.1193201
HOVER FOR ABSTRACT
PDF
Xplore

 ICMTS Sponsors:
 Top