Photo by Wan San Yip on Unsplash

IEEE International Conference on Microelectronic Test Structures

ICMTS 1999 Program

1999 Program Booklet


By First Author

Null holographic test structures for the measurement of overlay and its statistical variation
S. A. AbuGhazeleh, P. Christie1, V. Agrawal1, J. T. M. Stevenson2, A. J. Walton2, A. M. Gundlach2, S. Smith2
Dept. of Electr. & Comput. Eng., Delaware Univ., Newark, DE, USA
1Department of Electrical and Computer Engineering, University of Delaware, Newark, DE, USA
2Department of Electrical Engineering, University of Edinburgh, Edinburgh, UK
DOI: 10.1109/ICMTS.1999.766235
HOVER FOR ABSTRACT
PDF
Xplore
Sheet and line resistance of patterned SOI surface film CD reference materials as a function of substrate bias
R. A. Allen, E. M. Vogel, L. W. Linholm, M. W. Cresswell
Semiconductor Electronics Division, National Institute for Standards and Technology, Gaithersburg, MD, USA
DOI: 10.1109/ICMTS.1999.766215
HOVER FOR ABSTRACT
PDF
Xplore
3D characterization of RF power transistors
T. Arnborg, T. Johansson
Ericsson Components AB, Kista, Sweden
DOI: 10.1109/ICMTS.1999.766230
HOVER FOR ABSTRACT
PDF
Xplore
Measurement of N-well sheet resistance under p+ diffusion and p channel gate
R. A. Ashton
Bell Laboratories, Lucent Technologies, Inc., Orlando, FL, USA
DOI: 10.1109/ICMTS.1999.766214
HOVER FOR ABSTRACT
PDF
Xplore
A special test structure for the measurement of the injection dependent series resistance of power diodes
S. Bellone, S. Daliento1, A. Sanseverino1
DILIE-Department of Electrical Engineering & Computer Science, University of Salerno, Italy
1Department of Electronics and Telecommunications Engineering, University of Napoli Federico II, Italy
DOI: 10.1109/ICMTS.1999.766220
HOVER FOR ABSTRACT
PDF
Xplore
A simple physical extraction method for RD-RS of asymmetric MOSFETs
A. Blaum, J. Victory, C. C. McAndrew1
Advanced Circuit Research Lab-Europe, Motorola, Inc., Geneva, Switzerland
1Modeling Technology Laboratory, Motorola, Inc., Tempe, MD, USA
DOI: 10.1109/ICMTS.1999.766232
HOVER FOR ABSTRACT
PDF
Xplore
A high density matched hexagonal transistor structure in standard CMOS technology for high speed applications
A. Van den Bosch, M. Steyaert1, W. Sansen1
ESAT, Katholieke Univ., Leuven, Heverlee, Belgium
1ESAT-MICAS, Katholieke Universiteit Leuven, Heverlee, Belgium
DOI: 10.1109/ICMTS.1999.766245
HOVER FOR ABSTRACT
PDF
Xplore
Comparison of micro-electronic test structures for noise measurement verification
S. Van den Bosch, W. De Ketalaere1, L. Martens
University of Gent, IMEC, Gent, Belgium
1NA
DOI: 10.1109/ICMTS.1999.766213
HOVER FOR ABSTRACT
PDF
Xplore
Study of low frequency noise in the 0.18 µm silicon CMOS transistors
T. Boutchacha, G. Ghibaudo1, B. Belmekki
Laboratoire d'Analyse des Composants A Semiconducteurs, Institut d'Electronique, USTO, Algeria
1Laboratoire de Physique des Composants ä¡ Semiconducteurs, URA CNRS, ENSERG INPG, Grenoble, France
DOI: 10.1109/ICMTS.1999.766221
HOVER FOR ABSTRACT
PDF
Xplore
Contribution to the characterization of the hump effect in MOSFET submicronic technologies
H. Brut, R. M. D. A. Velghe1
Crolles Centre Commun, Central R&D-Modeling and Characteaizatioa, STMicroelectronics, Crolles, France
1Crolles Centre Commun, Central R&D-Modeling and Characteaizatioa, Philips Semiconductors, Crolles, France
DOI: 10.1109/ICMTS.1999.766241
HOVER FOR ABSTRACT
PDF
Xplore
A compact SOI model for fully-depleted and partially-depleted 0.25 µm SIMOX devices
Ping Chen, Zhihong Liu, Chune-Sin Yeh, Gang Zhang, K. Nishimura1, M. Shimaya1, T. Komatsu2
BTA Technologies, Inc., Santa Clara, CA, USA
1NTT Systems Electronics Laboratories, Atsugi, Japan
2NTT Advanced Technology Corporation, Musashino, Japan
DOI: 10.1109/ICMTS.1999.766248
HOVER FOR ABSTRACT
PDF
Xplore
The impact of noise parameter de-embedding on the high-frequency noise modeling of MOSFETs
M. J. Deen, Chih-Hung Chen
School of Engineering Science, Simon Fraser University, Burnaby, BC, Canada
DOI: 10.1109/ICMTS.1999.766212
HOVER FOR ABSTRACT
PDF
Xplore
Evaluation of test methods and associated test structures for interconnect reliability control
S. Foley, J. Molyneaux1, A. Mathewson
National Microelectronics Research Centre, University College-Lee Maltings, Cork, Ireland
1Analog Devices, Raheen Industrial Estate, Limerick, Ireland
DOI: 10.1109/ICMTS.1999.766237
HOVER FOR ABSTRACT
PDF
Xplore
Improved method for the oxide thickness extraction in MOS structures with ultra-thin gate dielectrics
G. Ghibaudo, S. Bruyere1, T. Devoivre2, B. DeSalvo3, E. Vincent2
Phelma, Grenoble, Rhône-Alpes, FR
1NA
2STMicroelectronics, Crolles, France
3URA CNRS ENSERG, Grenoble, France
DOI: 10.1109/ICMTS.1999.766226
HOVER FOR ABSTRACT
PDF
Xplore
Substrate resistance effect on the Fmax parameter of isolated BJT in BiCMOS process
D. Gloria, A. Perrotin, J. L. Carbonero, G. Morin
Central R&D, STMicroelectronics, Crolles, France
DOI: 10.1109/ICMTS.1999.766210
HOVER FOR ABSTRACT
PDF
Xplore
A statistical noise-tolerance analysis and test structure for logic families
M. Graziano, G. Masera, G. Piccinini, M. Ruo Roch, M. Zamboni
Dip. Elettronica, Politecnico di Torino, Torino, Italy
DOI: 10.1109/ICMTS.1999.766218
HOVER FOR ABSTRACT
PDF
Xplore
Comparison of sheet-resistance measurements obtained by standard and small-area four-point probing
N. M. P. Guillaume, M. W. Cresswell1, R. A. Allen1, S. Everist2, L. W. Linholm1
École Nationale Supérieure d'Electrotechnique, Electronique, Informatique, Toulouse, France
1Semiconductor Electronics Division, National Institute for Standards and Technology, Gaithersburg, MD, USA
2Sandia National Laboratories
DOI: 10.1109/ICMTS.1999.766217
HOVER FOR ABSTRACT
PDF
Xplore
Implementation of statistical characterisation and design techniques for an industrial 0.5 µm CMOS technology
S. Healy, E. Horan, K. McCarthy, A. Mathewson, Zhenqiu Ning1, E. Rombouts, W. Vanderbauwhede, M. Tack
National Microelectronics Research Centre, Cork, Ireland
1Alcatel Microelectronics, Oudenaarde, Belgium
DOI: 10.1109/ICMTS.1999.766249
HOVER FOR ABSTRACT
PDF
Xplore
Stress and recovery transients in bipolar transistors and MOS structures
F. Ingvarson, L. . -A. Ragnarsson, P. Lundgren, K. O. Jeppson
Department of Microelectronics, Solid State Electronics Laboratory, Chalmers University of Technology, Goteborg, Sweden
DOI: 10.1109/ICMTS.1999.766238
HOVER FOR ABSTRACT
PDF
Xplore
Direct parameter extraction techniques for a new poly-Si TFT model
B. Iniguez, Z. Xu, T. Fjeldly, M. S. Shur
Electrical, Computer and System Engineering Department, Rensselaer Polytechnic Institute, Troy, NY, USA
DOI: 10.1109/ICMTS.1999.766247
HOVER FOR ABSTRACT
PDF
Xplore
Test structure for measurement of ion stopping power
H. Kanata, Y. Tosaka, H. Ehara, S. Satoh
Fujitsu Laboratories Limited, Atsugi, Japan
DOI: 10.1109/ICMTS.1999.766240
HOVER FOR ABSTRACT
PDF
Xplore
Automated generation of SPICE characterization test masks and test databases
L. Kasel, C. C. McAndrew, P. Drennan, W. F. Davis, R. Ida
Motorola, Inc., Tempe, USA
DOI: 10.1109/ICMTS.1999.766219
HOVER FOR ABSTRACT
PDF
Xplore
On-wafer calibration techniques for giga-hertz CMOS measurements
T. E. Kolding
RF Integrated Systems & Circuits (RISC) group, University of Aalborg, Aalborg, Denmark
DOI: 10.1109/ICMTS.1999.766225
HOVER FOR ABSTRACT
PDF
Xplore
Simple technique for the measurement of thermal time constants of microbolometer structures
P. Lambkin, N. Folan1, B. Lane
National Microelectronics Research Centre, Cork, Ireland
1NA
DOI: 10.1109/ICMTS.1999.766239
HOVER FOR ABSTRACT
PDF
Xplore
Measurement of VT and Leff using MOSFET gate-substrate capacitance
M. M. Lau, C. Y. T. Chiang1, Y. T. Yeow, Z. Q. Yao2
Department of Computer Science and Electrical Engineering, University of Queensland, Brisbane, QLD, Australia
1NA
2Quality Semiconductors Australia, Sydney, Australia
DOI: 10.1109/ICMTS.1999.766234
HOVER FOR ABSTRACT
PDF
Xplore
A new extraction method for BSIM3v3 model parameters of RF silicon MOSFETs
Seonghearn Lee, Hyun Kyu Yu1
Department of Electronic Engineering, Hankuk University of Foreign Studies, Yongin si, South Korea
1Electronics and Telecommunications Research Institute, Micro-Electronics Technology Laboratory, Taejon, South Korea
DOI: 10.1109/ICMTS.1999.766223
HOVER FOR ABSTRACT
PDF
Xplore
A new procedure for extraction of series resistances for bipolar transistors from DC measurements
M. Linder, F. Ingvarson1, K. O. Jeppson1, J. V. Grahn, S. . -L. Zhang, M. Ostling
Department of Electronics, Device Technology Laboratory, Royal Institute of Technology, Kista, Sweden
1Department of Microelectronics ED, Solid State Electronics Laboratory, Chalmers University of Technology, Gothenburg, Sweden
DOI: 10.1109/ICMTS.1999.766233
HOVER FOR ABSTRACT
PDF
Xplore
Inclusion of substrate effects in the flyback method for BJT resistance characterisation
D. MacSweeney, K. McCarthy, A. Mathewson, J. A. Power1, S. C. Kelly1
National Microelectronics Research Centre, University College Cork, Ireland
1Analog Devices, Inc., Limerick, Ireland
DOI: 10.1109/ICMTS.1999.766242
HOVER FOR ABSTRACT
PDF
Xplore
Evolution of the Si-SiO2 interface trap characteristics with Fowler-Nordheim injection
Y. Maneglia, D. Bauza
UMR CNRS 5531, LPCS, ENSERG/INPG, Grenoble, France
DOI: 10.1109/ICMTS.1999.766227
HOVER FOR ABSTRACT
PDF
Xplore
Test structure for direct extraction of capacitance matrix in VLSI
T. Mido, H. Ito, K. Asada
Department of Electronic Engineering, (VLSI Design and Education Center (VDEC)), University of Tokyo, Bunkyo, Tokyo, Japan
DOI: 10.1109/ICMTS.1999.766243
HOVER FOR ABSTRACT
PDF
Xplore
The fabrication of electrical linewidth structures capable of TEM measurement using standard <100> wafers
C. G. Munro, A. M. Gundlach, J. T. M. Stevenson, D. W. Travis, S. Smith, N. S. Rankin, A. J. Walton
Edinburgh Microfabrication Facility Department of Electrical Engineering, University of Edinburgh, Edinburgh, UK
DOI: 10.1109/ICMTS.1999.766208
HOVER FOR ABSTRACT
PDF
Xplore
Identification of MOS oxide defect location with a spatial resolution less than 0.1 µm using photoemission microscope
T. Ohzone, M. Yuzaki, T. Matsuda, E. Kameda1
Department of Electronics and Informatics, Toyama Prefectural University, Toyama, Japan
1Department of Electrical Engineering, Toyama National College of Maritime Technology, Toyama, Japan
DOI: 10.1109/ICMTS.1999.766222
HOVER FOR ABSTRACT
PDF
Xplore
A capacitance-voltage measurement method for DMOS transistor channel length extraction
J. Olsson, R. Valtonen, U. Heinle, L. Vestling, A. Soderbarg, H. Norde
The Ångström Laboratory, Solid-state Electronics, University of Uppsala, Uppsala, Sweden
DOI: 10.1109/ICMTS.1999.766231
HOVER FOR ABSTRACT
PDF
Xplore

A thermal van der Pauw test structure
O. Paul, L. Plattner1, H. Baltes1
Institute for Microsystem Technology, University of Freiburg, Freiburg im Breisgau, Germany
1Physical Electronics Laboratory, ETH Hoenggerberg HPT, Zurich, Switzerland
DOI: 10.1109/ICMTS.1999.766216
HOVER FOR ABSTRACT
PDF
Xplore
Test structure design for a fast and simple evaluation of carrier mobilities in highly injected regions
G. V. Persiano
Facoltà di Ingegneria, Università del Sannio, Benevento, Italy
DOI: 10.1109/ICMTS.1999.766224
HOVER FOR ABSTRACT
PDF
Xplore
An investigation of on-chip spiral inductors on a 0.6 µm BiCMOS technology for RF applications
J. A. Power, S. C. Kelly, E. C. Griffith, M. O'Neill
Analog Devices, Raheen Industrial Estate, Limerick, Ireland
DOI: 10.1109/ICMTS.1999.766209
HOVER FOR ABSTRACT
PDF
Xplore
A new test structure for direct extraction of SPICE model parameters for double polysilicon bipolar transistors
M. Sanden, Shi-Li Zhang, J. V. Grahn, M. Ostling
Department of Electronics, Kungliga Tekniska Högskolan, Kista, Sweden
DOI: 10.1109/ICMTS.1999.766211
HOVER FOR ABSTRACT
PDF
Xplore
Geometry modeling method for narrow/short and narrow MOSFETs
S. Sekine, M. Sugiyama, N. Saito
Computational Technologies Laboratory, Motorola Japan Limited, Sendai, Miyagi, Japan
DOI: 10.1109/ICMTS.1999.766229
HOVER FOR ABSTRACT
PDF
Xplore
Identification of plasma induced damage conditions in VLSI designs
P. Simon, W. Maly1
Philips Semiconductors, Nijmegen, Netherlands
1Department of Electrical and Computer Engineering, Carnegie Mellon University, Pittsburgh, USA
DOI: 10.1109/ICMTS.1999.766206
HOVER FOR ABSTRACT
PDF
Xplore
Analysis of current flow in mono-crystalline electrical linewidth structures
S. Smith, I. A. B. Lindsay, A. J. Walton, M. W. Cresswell, L. W. Linholm, R. A. Allen, M. Fallon, A. M. Gundlach
Department of Electronics and Electrical Engineering, University of Edinburgh, Edinburgh, UK
DOI: 10.1109/ICMTS.1999.766207
HOVER FOR ABSTRACT
PDF
Xplore
Investigation of optical proximity correction (OPC) and non-uniformities on the performance of resistivity and linewidth measurements
S. Smith, A. J. Walton, M. Fallon1
Department of Electronics and Electrical Engineering, University of Edinburgh, Edinburgh, UK
1National Semiconductors (Israel) Limited, Greenock, UK
DOI: 10.1109/ICMTS.1999.766236
HOVER FOR ABSTRACT
PDF
Xplore
Extraction of the trap density at the gate periphery using the gated diode array for giga-bit DRAMs
H. Suzuki, M. Kojima, Y. Nara
Fujitsu Laboratories Limited, Atsugi, Japan
DOI: 10.1109/ICMTS.1999.766228
HOVER FOR ABSTRACT
PDF
Xplore
CMOS 1/f noise modelling and extraction of BSIM3 parameters using a new extraction procedure
J. C. Vildeuil, M. Valenza, D. Rigaud
Centre dElectronique et de Micro-optoélectronique de Montpellier, Universite Montpellier II, Montpellier, France
DOI: 10.1109/ICMTS.1999.766244
HOVER FOR ABSTRACT
PDF
Xplore

 ICMTS Sponsors:
 Top